Woofun AI reports that UBS released comprehensive research on June 26 detailing the expanding demand within the Chinese AI hardware supply chain, which now extends beyond GPUs to include PCBs, optical interconnects, liquid cooling, SiC substrates, and optical communication materials. The report highlights that multiple industry links have established optimistic timelines and capacity targets to meet this surging infrastructure requirement. Bitmain has positioned its GPU roadmap to extend through 2028, with the BR20X scheduled for commercial launch in 2026 and the BR30X and BR31X models targeted for 2028. The BR20X series is specifically planned for a second-half 2026 debut, featuring significant upgrades in computing power, memory capacity, and interconnect bandwidth.

However, the execution of this roadmap faces constraints including advanced process limitations, packaging challenges, customer mass production rhythms, software ecosystem adaptation, and external export restrictions.

Sheng Hong Technology plans to invest no more than 18 billion yuan in fixed assets by 2026, with capital primarily directed toward Huizhou Factory units 10 through 13. Management stated that AI PCB raw material costs remain stable, leading to an expectation that gross margins for the 2026 fiscal year will stay roughly the same as in 2025. The company projects that the proportion of revenue derived from AI will increase from below 50% to a range of 60% to 70%. Regarding the Rubin platform, the firm maintains a majority share in NVIDIA's Rubin compute tray HDI, with an overall customer share target of about 50%. The material plan for the orthogonal backplane required for Rubin Ultra is still under evaluation, with options including Q-glass and PTFE being considered for implementation.

In the optical interconnect sector, Company B holds approximately an 88% market share in the independent scale-up photonics interconnect solution market, with a strategic focus on LPO, NPO, and other advanced solutions. Its optical computing processor utilizes 3D TSV vertical stacking technology to offload computing tasks directly to the silicon photonics layer. Company C Optoelectronics acquired a controlling stake in Shenzhen Tongsheng Optoelectronics Co., Ltd. in June 2026, marking its entry into the hollow-core optical fiber cable field. Management targets indicate that the optoelectronics business could contribute significantly to the profit and loss statement starting in 2027, with revenue potential estimated at about 10 billion RMB. On the liquid cooling front, the strategic goal is to become the largest shareholder of Yuans Tech, with liquid cooling business revenue expected to reach the tens of billions of yuan scale in the 2026 fiscal year.

Woofun AI data shows that cold plate, manifold, and UOD single machine values are approximately $40,000 to $50,000.

In the power device chain, Tianyue Advanced reports strong demand and saturated orders across its production lines. First-quarter 2026 prices are overall stable, but the company has implemented selective price increases for small customers' urgent orders to manage allocation. The company aims for 50% of shipments to come from higher-margin 8-inch SiC substrates in 2026. High-power AI servers and data center power systems are emerging as new demand sources for SiC, operating alongside traditional sectors such as electric vehicles, photovoltaics, and energy storage. Order saturation and selective price increases indicate that supply tightness is impacting prices in certain scenarios, signaling a shift in market dynamics. This concentration of capital and capacity expansion marks a definitive shift toward specialized hardware dominance in the region.